Analisis Kegagalan Komponen Nozzle Baja Karbon AISI 1045 Pada Lingkungan Adonan Wafer di Mesin Wafer Stick PT.X

Syarifutra, Sendy Fauzi (2026) Analisis Kegagalan Komponen Nozzle Baja Karbon AISI 1045 Pada Lingkungan Adonan Wafer di Mesin Wafer Stick PT.X. Other thesis, Institut Teknologi Sepuluh Nopember.

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Abstract

Industri makanan dan minuman di Indonesia selalu mengalami pertumbuhan yang signifikan dengan peningkatan permintaan konsumen terhadap produk makanan seperti wafer stick, beragam isi cream filling seperti perisa cokelat, vanila, serta kopi menjadi suatu peran penting dalam hasil produk wafer stick. Pada industri wafer stick terdapat limitasi hasil produk yang sesuai dengan standar yang diinginkan. Keterbatasan dalam hasil produksi selalu didasari dengan kegagalan material komponen pada mesin wafer stick. Pada umumnya keterbatasan hasil produksi industri wafer stick disebabkan oleh material komponen nozzle. Defect pada diameter serta visual dari wafer stick sebagian besar didasari oleh komponen nozzle yang telah mengalami keausan (wear), seperti keausan abrasif, dan keausan adhesif.. Pada penelitian ini dilakukan analisis kegagalan berupa pengumpulan data operasi lapangan dan mesin, uji OES, uji metalografi, uji kekerasan, uji SEM EDX, dan uji XRD, daan uji kekasaran permukaan. Hasil OES menunjukkan material tidak sepenuhnya memenuhi spesifikasi AISI 1045, yaitu kadar karbon 0,36% dan sulfur 0,12% (jauh di atas maksimum 0,05%), sehingga ketahanan aus rendah dan kekerasan rendah. Metalografi memperlihatkan struktur ferit-perlit tanpa
pengerasan yang stabil pada ketiga spesimen. Uji kekerasan menunjukkan nilai bulk yang relatif stabil (232,84, 232.56, dan 224,74 HV), membuktikan tidak adanya pelunakan termal, transformasi fasa, maupun penggetasan, sehingga kegagalan bersumber dari permukaan kerja, bukan degradasi internal. SEM-EDS mendeteksi unsur kalsium dari lingkungan adonan, serta alur alur sejajar akibat keausan. XRD mengidentifikasi kalsit (CaCO₃) yang membuktikan terbentuknya deposit adonan. Hasil kekasaran permukaan kulit wafer dengan Ra 20.9812 µm dan Rz 109.5806 µm membuat potensi partikel kausan adhesif dari kontak roller dan nozzle ikut pada saat kulit wafer tergulung, roller yang juga berbahan AISI 1045 dengan kekerasan identik memperbesar risiko adhesive wear. Disimpulkan bahwa kegagalan nozzle merupakan three body abrasive wear, yaitu sinergi antara aus adhesif dari kontak roller dan nozzle dan abrasif three-body sebagai mekanisme utama.
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The food and beverage industry in Indonesia has always experienced significant growth with increasing consumer demand for food products such as wafer sticks, various cream fillings such as chocolate, vanilla, and coffee flavors play an important role in the results of wafer stick products. In the wafer stick industry, there are limitations in product results that meet the desired standards. Limitations in production results are always based on the failure of component materials in the wafer stick machine. In general, the limitations in the production results of the wafer stick industry are caused by the nozzle component material. Defects in the diameter and visual of the wafer stick are mostly based on nozzle components that have experienced wear, such as abrasive wear, and adhesive wear. In this study, a failure analysis was carried out in the form of collecting field and machine operation data, OES tests, metallographic tests, hardness tests, SEM EDX tests, and XRD tests, and surface roughness tests. The OES results showed that the material did not fully meet the AISI 1045 specifications, namely 0.36% carbon and 0.12% sulfur content (far above the maximum of 0.05%), resulting in low wear resistance and low hardness. Metallography shows a stable, unhardened ferrite-pearlite structure in all three specimens. Hardness tests show relatively stable bulk values (232.84, 232.56, and 224.74 HV), proving the absence of thermal softening, phase transformation, or embrittlement, so that the failure originates from the work surface, not internal degradation. SEM-EDS detects calcium elements from the dough environment, and parallel grooves due to wear. XRD identifies calcite (CaCO₃) dough deposits. The results of the wafer skin surface roughness with Ra 20.9812 µm and Rz 109.5806 µm make the potential for adhesive wear particles from the roller and nozzle contact to be involved when the wafer skin is rolled, the roller is also made of AISI 1045 with identical hardness increasing the risk of adhesive wear. It was concluded that the nozzle failure was three-body abrasive wear, namely the synergy between adhesive wear from the roller and nozzle contact and three-body abrasive as the main mechanism.

Item Type:	Thesis (Other)
Uncontrolled Keywords:	Analisis Kegagalan, AISI 1045, Wafer Stick, Keausan, Nozzle, SEM-EDX, Failure Analysis, AISI 1045, Wafer Stick, Wear, Nozzle, SEM-EDX
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA169.5 Failure analysis
Divisions:	Faculty of Industrial Technology and Systems Engineering (INDSYS) > Material & Metallurgical Engineering > 28201-(S1) Undergraduate Thesis
Depositing User:	Sendy Fauzi Syarifutra
Date Deposited:	24 Jul 2026 02:59
Last Modified:	24 Jul 2026 02:59
URI:	http://repository.its.ac.id/id/eprint/136444

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