PENURUNAN CACAT “NO BOOTING” PADA PROSES PERAKITAN PCBA MENGGUNAKAN SIX SIGMA

Hadinata, Novian (2026) PENURUNAN CACAT “NO BOOTING” PADA PROSES PERAKITAN PCBA MENGGUNAKAN SIX SIGMA. Masters thesis, Institut Teknologi Sepuluh Nopember.

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Abstract

Kegagalan fungsional pada komponen elektronik bernilai tinggi merupakan salah satu sumber kerugian terbesar di industri perakitan elektronik karena menimbulkan beban ganda, yaitu biaya material dari komponen yang dibuang dan biaya diagnosis ketika penyebab kegagalan salah diidentifikasi. Kondisi tersebut terjadi pada proses Printed Circuit Board Assembly atau PCBA di PT XYZ. Cacat No Booting pada komponen Integrated Circuit System on Chip atau IC SoC di stasiun Digital Rights Management atau DRM dan Digital Function Test atau DFT selama periode baseline berada pada tingkat 3.279,19 PPM dengan level sigma 4,22 dan menimbulkan kerugian material sekitar 17.233 USD, sehingga menjadi Critical to Quality utama yang membutuhkan perbaikan sistematis, bukan sekadar penggantian komponen berulang. Penelitian ini bertujuan menurunkan cacat tersebut menggunakan metode Six Sigma dengan kerangka Define, Measure, Analyze, Improve, dan Control atau DMAIC. Tahap Analyze melalui Pareto diagram, fishbone 6M, dan Failure Mode and Effects Analysis atau FMEA menemukan akar penyebab dominan bukan pada kerusakan IC SoC, melainkan pada celah termal antara thermal pad dan heatsink pada fixture pengujian. Tahap Improve mengarahkan perbaikan pada fixture, mencakup penggantian thermal pad, penyetelan ulang heatsink, modifikasi leveler pneumatik, dan penambahan fan pendingin, yang terbukti menurunkan suhu kerja IC SoC jauh di bawah ambang thermal shutdown. Setelah perbaikan, cacat turun menjadi 544,34 PPM atau berkurang 83,40% dan level sigma naik menjadi 4,77, dengan penurunan yang terbukti signifikan secara statistik. Perbaikan tersebut menghasilkan penghematan material sekitar 5.014 USD serta penghematan waktu penanganan NG sekitar 610 jam kerja selama dua bulan pasca perbaikan, dengan kebutuhan investasi yang kecil dan kembali dalam hitungan hari. Tahap Control mengunci hasil melalui instruksi kerja, check sheet inspeksi, pelatihan operator, Layered Process Audit, dan control plan. Penelitian ini menunjukkan bahwa sebagian besar tindakan penggantian komponen pada kasus No Booting sebenarnya tidak diperlukan karena akar masalah berada pada sistem pengujian, bukan pada komponen.
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Functional failures in high value electronic components are among the largest sources of loss in electronics assembly because they create a double burden, namely material cost from scrapped components and diagnostic cost when the failure cause is misidentified. This condition occurred in the Printed Circuit Board Assembly (PCBA) process at PT XYZ. During the baseline period, the No Booting defect on the Integrated Circuit System on Chip (IC SoC) component at the Digital Rights Management (DRM) and Digital Function Test (DFT) stations stood at 3,279.19 PPM with a sigma level of 4.22 and caused material losses of about USD17,233, making it the main Critical to Quality that required systematic improvement rather than repeated component replacement. This study aims to reduce the defect using the Six Sigma method within the Define, Measure, Analyze, Improve, and Control (DMAIC) framework. The Analyze phase, through a Pareto diagram, a 6M fishbone diagram, and Failure Mode and Effects Analysis (FMEA), identified the dominant root cause not as IC SoC component failure but as a thermal gap between the thermal pad and the heatsink on the test fixture. The Improve phase directed corrective actions to the fixture, including thermal pad replacement, heatsink height readjustment, pneumatic leveler modification, and the addition of a cooling fan, which brought the IC SoC operating temperature well below the thermal shutdown threshold. After improvement, the defect rate fell to 544.34 PPM, a reduction of 83.40%, and the sigma level rose to 4.77, a decrease confirmed to be statistically significant. The improvement generated material savings of about USD5,014 and about 610 labor hours saved in NG handling over the two month post improvement period, with a small investment that paid back within days. The Control phase locked in the results through work instructions, inspection check sheets, operator training, Layered Process Audits, and a control plan. This study demonstrates that most component replacement actions in No Booting cases are in fact unnecessary because the root cause lies in the test system rather than in the component.

Item Type:	Thesis (Masters)
Uncontrolled Keywords:	Six Sigma, DMAIC, No Booting, IC SoC, fixture termal, false NG. ================================================================== Six Sigma, DMAIC, No Booting, IC SoC, thermal fixture, false NG.
Subjects:	T Technology > TS Manufactures > TS183 Manufacturing processes. Lean manufacturing.
Divisions:	Interdisciplinary School of Management and Technology (SIMT) > 61101-Master of Technology Management (MMT)
Depositing User:	Novian Hadinata
Date Deposited:	24 Jul 2026 07:19
Last Modified:	24 Jul 2026 07:19
URI:	http://repository.its.ac.id/id/eprint/137174

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