Navijanti, Vivin (1997) Studi Pelapisan Logam Aluminium, Tembaga, dan Seng dengan Poliakrilonitril Secara Elektrolisis. Other thesis, Institut Teknologi Sepuluh Nopember.
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1490100014-Undergraduate_Thesis(1).pdf Restricted to Repository staff only Download (3MB) |
Abstract
Salah satu cara untuk menghambat terjadinya korosi adalah dengan melapisi logam dengan bahan polimer. Oleh karena itu dilakukan penelitian tentang pelapisan pada logam-logam aluminium, tembaga, dan seng dengan monomer akrilonitril 20 ml dan larutan elektrolit H₂SO₄ 0,5 M sampai volumenya 200 ml, yang dipolimerisasi melalui proses polimerisasi elektroinisiasi. Logam-logam yang akan dilapisi tersebut digunakan sebagai elektroda negatif (katoda), sedangkan elektroda anodanya digunakan platina spiral. Masing-masing logam dielektrolisa dengan memberikan tegangan yang bervariasi (dari 8 sampai 14 volt) selama 2 jam. Dengan melihat langsung hasil setelah proses terjadi, hanya logam aluminium yang dapat terlapisi, yaitu pada tegangan 12 volt dengan berat lapisan 0,0138 gram.
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The one ways inhibited corrosion was coated the metal with polymer substance. Therefore it was have been done an experiment about the coatings of aluminum, copper, and zinc with 20 ml of acrylonitrile monomer and 0.5 M H₂SO₄ aqueous solution until the volume to be 200 ml, by electrolitycally initiated polimerization. The metals that would be coated used as cathodes, while the spiral platinum used as the anode. Each metal was electrolized with give it various voltage (8 to 14 volt) for 2 hours. With direct watched on the result after processing, just the aluminum could be coated at the voltage was 12 volt with coating weight was 0.0138 grams.
| Item Type: | Thesis (Other) |
|---|---|
| Additional Information: | RSKi 671.73 Nav s |
| Subjects: | Q Science > QD Chemistry > QD481 Chemical structure. |
| Divisions: | Faculty of Mathematics and Science > Physics > 45201-(S1) Undergraduate Thesis |
| Depositing User: | magang . |
| Date Deposited: | 20 Oct 2026 02:04 |
| Last Modified: | 20 Oct 2026 02:04 |
| URI: | http://repository.its.ac.id/id/eprint/145685 |
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