Studi Pengaruh Anhidrida terhadap Sifat Mekanik dan Stabilitas Termal Curing Agent Baru untuk Resin Epoksi pada Aplikasi Printed Circuit Board

Yunus, Muhammad (2017) Studi Pengaruh Anhidrida terhadap Sifat Mekanik dan Stabilitas Termal Curing Agent Baru untuk Resin Epoksi pada Aplikasi Printed Circuit Board. Undergraduate thesis, Institut Teknologi Sepuluh Nopember.

[img] Text
2713100121_Undergraduate_Theses.pdf
Restricted to Repository staff only

Download (3MB) | Request a copy

Abstract

Penelitian ini dilakukan untuk mengembangkan produk polimer berbasis sistem Anhidrida yang memiliki sifat mekanik dan stabilitas termal yang baik pada aplikasi Printed Circuit Board. Produk polimer ini menggunakan bahan dasar epoksi dengan variasi pengisi Pthalic Anhidrida/Maleat Anhidrida, Anilin, Anilin/Maleat Anhidrida, dan Maleat Anhidrida. Pengujian yang dilakukan yaitu uji Scanning Electron Microscope, uji massa jenis, uji Fourier Transform Infrared Spectroscopy, uji kekerasan shore D, uji kekuatan tarik, dan uji Thermogravimetri Analysis. Pengujian sifat kekerasan menunjukan peningkatan nilai kekerasan dengan variasi pengisi Pthalic Anhidrida/Maleat Anhidrida, Anilin, Anilin/Maleat Anhidrida, dan Maleat Anhidrida dengan tertinggi pada variasi Maleat Anhidrida sebesar 81,67 HD.. Pengujian kekuatan tarik menunjukan peningkatan kekuatan tarik terbaik dengan variasi pengisi Maleat Anhidrida dengan kekuatan tarik sebesar 37,94 MPa. Pengujian stabilitas temperatur menunjukan peningkatan dengan variasi Pthalic Anhidrida/Maleat Anhidrida, Anilin, Anilin/Maleat Anhidrida, dan Maleat Anhidrida. Stabilitas temperatur tertinggi terdapat pada variasi pengisi Anilin dengan T5 337.4 OC. Berdasarkan hasil tersebut terdapat pengaruh penambahan jenis asam terhadap sifat mekanik dan stabilitas termal curing agent baru untuk resin epoksi pada aplikasi printed circuit board. ============================================================================================ This research has done to develop anhydride based polymer product with having good thermal stability and mechanical properties for Printed Circuit Board application. This polymer product was based on epoxy resin and ammonia with the variation of Pthalic Anhydride/Maleic Anhydride, Aniline, Aniline/Maleic Anhydride, and Maleic Anhydride. Test that have been done on this research are Scanning Electron Microscope test, Fourier Transform Infrared Spectroscopy test, Density test, Tensile test, Hardness Test Shore D, and Thermogravimetric Analysis. Hardness test result shows increase on all variation hardness value with highest value of hardness on Maleic Anhydride which value is 81,67 HD. . Tensile test shows increase on all variation tensile value with highest value of tensile on Maleic Anhydride which value is 37,94 MPa. Thermogravimetric Analysis test shows increase of thermal stability on all variation value with highest thermal stability on Aniline which value T5 337.4 OC. Based on the result known that anhydride has effect on mechanical properties and thermal stability new curing agent for epoxy resin application in printed circuit board.

Item Type: Thesis (Undergraduate)
Uncontrolled Keywords: Epoksi, curing agent, temperatur, sifat mekanik, stabilitas termal, mechanical properties
Subjects: T Technology > TA Engineering (General). Civil engineering (General) > TA418.9 Composite materials. Laminated materials.
Divisions: Faculty of Industrial Technology > Material & Metallurgical Engineering > 28201-(S1) Undergraduate Thesis
Depositing User: Yunus Muhammad
Date Deposited: 06 Oct 2017 09:14
Last Modified: 03 Jan 2018 04:03
URI: http://repository.its.ac.id/id/eprint/44683

Actions (login required)

View Item View Item