Subtitusi Plat Tembaga Pada Antena Microstrip Menggunakan Fast Dried Conductive Nanocopper Dan Nanosilver Paint

Pujiyanto, Royyan Wafi (2022) Subtitusi Plat Tembaga Pada Antena Microstrip Menggunakan Fast Dried Conductive Nanocopper Dan Nanosilver Paint. Other thesis, Institut Teknologi Sepuluh Nopember Surabaya.

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Abstract

Patch antena mikrostrip biasanya terbuat dari lembar tembaga ukuran besar yang diperkecil, metode ini menggunakan dilusi oleh FeCl3 yang belum cukup mudah, kurang efisien dari segi biaya dan waktu, serta tidak ramah lingkungan. Untuk mempermudah aplikasi dan mengefisiensikan biaya, maka penelitian ini menggunakan tembaga yang disintesis secara bottom-up dari proses reduksi kimia senyawa organik dan penstabil capping agent yang disebut nanopartikel tembaga. Tujuan yang ingin diperoleh dari penelitian ini yaitu diciptakannya metode pembuatan antena mikrostrip dari bahan nanopartikel yang memudahkan dalam aplikasi, ramah lingkungan, dan ekonomis. Berdasarkan hasil uji tape test, komposisi binding agent dan conductive paint untuk patch antenna yang menghasilkan adhesi terbaik yaitu 60:40 (w/w). Pabrikasi patch antenna microstrip menggunakan conductive paint memanfaatkan metode pengecatan di area fr4 yang telah dimasking sehingga proses pembuatan lebih cepat dibandingkan dengan proses dilusi pada antenna tembaga murni. Hal ini juga mengurangi penggunaan FeCl3 sehingga ramah lingkungan. Berdasarkan pengukuran konduktifitas surface resistance, hasil pada tembaga murni bernilai 0.1 ohm, nanocopper paint 0.3 ohm, dan nanosilver paint 0.2 ohm. Berdasarkan uji VSMR, nilai terendah yaitu tembaga murni dengan nilai 2,32 GHz, diikuti oleh nanocopper sebesar 2,41 GHz, dan nanosilver sebesar 2,45 GHz. Kemudian, berdasarkan uji return loss, gelombang yang paling sesuai ada pada antenna conductive paint silver dengan nilai S11 = -19.42db, diikuti dengan conductive paint copper dengan nilai S11 = -37db, kemudian yang terendah tembaga murni dengan return nilai S11 = -17db.
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Microstrip patch antennas are usually made of large size copper sheet which is reduced, this method uses dilution by FeCl3 which is less efficient in terms of cost, time, and effort, also not environmentally friendly. In order to simplify the application and make cost efficient, this research uses copper which is synthesized in a bottom-up manner from chemical reduction process of organic compounds and capping agent stabilizer, called copper nanoparticles. The goal to be obtained from this research is to create a method for making microstrip antennas from nanoparticles that are easy to apply, environmentally friendly, and economical. Based the tape test result, the composition of the binding agent and conductive paint which produced the best adhesion was 60:40 (w/w). Fabrication of microstrip patch antennas using conductive paint utilizes the painting method in the FR4 area which has been masked so that the manufacturing process is faster than the FeCl3 dilution process in pure copper antennas, thus making it environmentally friendly. Based on surface resistance conductivity measurements, the results for pure copper were 0.1 ohm, nanocopper paint 0.3 ohm, and nanosilver paint 0.2 ohm. Based on the VSMR test, the lowest value was pure copper with a value of 2.32 GHz, followed by nanocopper at 2.41 GHz, and nanosilver at 2.45 GHz. Then, based on the return loss test the most suitable wave is in a conductive paint silver antenna with a value of S11 = -19.42db, followed by conductive paint copper with a value of S11 = -37db, then the lowest is pure copper with a return value of S11 = -17db.

Item Type:	Thesis (Other)
Uncontrolled Keywords:	Antena Mikrostrip, Tembaga, Conductive paint
Subjects:	T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK5103.2 Wireless communication systems. Two way wireless communication T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK5101 Telecommunication
Divisions:	Faculty of Intelligent Electrical and Informatics Technology (ELECTICS) > Electrical Engineering > 20201-(S1) Undergraduate Thesis
Depositing User:	Royyan Wafi Pujiyanto
Date Deposited:	01 Feb 2023 02:31
Last Modified:	01 Feb 2023 02:31
URI:	http://repository.its.ac.id/id/eprint/95893

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