Pengaruh Vinil Ester Terhadap Sifat Mekanik Dan Ketahanan Termal Polimer Blend Epoksi/Vinil Ester Sebagai Material Kandidat Printed Circuit Board (Pcb)

Sarifah, Dayu (2016) Pengaruh Vinil Ester Terhadap Sifat Mekanik Dan Ketahanan Termal Polimer Blend Epoksi/Vinil Ester Sebagai Material Kandidat Printed Circuit Board (Pcb). Undergraduate thesis, Institut Teknologi Sepuluh Nopember.

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Abstract

Epoksi sering digunanakan sebagai matriks dari bahan Printed Circuit Board (PCB), namun penggunaan epoksi tersebut terkendala oleh ketangguhan serta elongasinya yang cukup rendah. Oleh karena itu perlu dilakukan suatu penelitian untuk menanggulangi kekurangan tersebut. Dan pada penelitian ini dilakukan studi terkait pengaruh penambahan Vinil Ester terhadap sifat mekanik dan ketahanan termal terhadap Polimer Blend Epoksi/Vinil Ester. Variasi penambahan Vinil Ester (Ripoxy R- 802 EX-1) sebesar 0, 10, 20, 30, 40, 50, 80, dan 100 % berat. Berdasarkan hasil penelitian diperoleh kekuatan tarik Polimer Blend Epoksi/Vinil Ester mengalami peningkatan yang signifikan pada penambahan 50% Vinil Ester dengan nilai kekuatan 68,30 MPa dengan nilai kekerasan 80,80 Shore D. Untuk termal dari Polimer Epoksi/Vinil Ester dengan temperatur degradasi tertinggi dimiliki oleh material Epoksi/VE (50) dengan temperatur degradasi tertinggi 356,64oC dan berat sisa 5,01%. Dan dari morfologi hasil pencampuran Epoksi dan Vinil Ester diperoleh fasa tunggal atau misible. Berdasarkan hasil penelitian tersebut Polimer Blend Epoksi/Vinil Ester dapat diajukan sebagai kandidat Printed Circuit Board (PCB). =========================================================== Epoxy is often used as a matrix of Printed Circuit Board (PCB), but is limited by the toughness and elongation of epoxy which is fairly low. Therefore, it is necessary to do some research to overcome these shortcomings. This research is conducted to identify the effect of addition of vinyl ester on mechanical properties and thermal resistance of the Polymer Blend Epoxy/Vinyl Ester. Variations addition of Vinyl Ester in 0, 10, 20, 30, 40, 50, 80, and 100 weight. The research showed a significant enhancement of tensile strength in addition of 50 Vinyl Ester with a strength value by 68.30 MPa and the hardness of 80,80 Shore D. The highest thermal stability is reached by adding 50 of vinyl ester at 356,64oC and residual weight at 5.01. The morphology of mixing epoxy and vinyl ester shows a goodmiscibility with a single phase form. Based on these results, Polymer Blend Epoxy/Vinyl Ester may be filed as a candidate for Printed Circuit Board (PCB).

Item Type: Thesis (Undergraduate)
Additional Information: RSMt 620.118 Sar d
Uncontrolled Keywords: epoksi, miscible, polimer blend, printed circuit board (PCB), vinil ester
Subjects: T Technology > TA Engineering (General). Civil engineering (General) > TA418.9 Composite materials. Laminated materials.
Divisions: Faculty of Industrial Technology > Material & Metallurgical Engineering > 28201-(S1) Undergraduate Thesis
Depositing User: EKO BUDI RAHARJO
Date Deposited: 30 Oct 2019 06:29
Last Modified: 30 Oct 2019 06:29
URI: http://repository.its.ac.id/id/eprint/71499

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