Sarifah, Dayu (2016) Pengaruh Vinil Ester Terhadap Sifat Mekanik Dan Ketahanan Termal Polimer Blend Epoksi/Vinil Ester Sebagai Material Kandidat Printed Circuit Board (Pcb). Undergraduate thesis, Institut Teknologi Sepuluh Nopember.
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Abstract
Epoksi sering digunanakan sebagai matriks dari bahan Printed
Circuit Board (PCB), namun penggunaan epoksi tersebut
terkendala oleh ketangguhan serta elongasinya yang cukup rendah.
Oleh karena itu perlu dilakukan suatu penelitian untuk
menanggulangi kekurangan tersebut. Dan pada penelitian ini
dilakukan studi terkait pengaruh penambahan Vinil Ester terhadap
sifat mekanik dan ketahanan termal terhadap Polimer Blend
Epoksi/Vinil Ester. Variasi penambahan Vinil Ester (Ripoxy R-
802 EX-1) sebesar 0, 10, 20, 30, 40, 50, 80, dan 100 % berat.
Berdasarkan hasil penelitian diperoleh kekuatan tarik Polimer
Blend Epoksi/Vinil Ester mengalami peningkatan yang signifikan
pada penambahan 50% Vinil Ester dengan nilai kekuatan 68,30
MPa dengan nilai kekerasan 80,80 Shore D. Untuk termal dari
Polimer Epoksi/Vinil Ester dengan temperatur degradasi tertinggi
dimiliki oleh material Epoksi/VE (50) dengan temperatur
degradasi tertinggi 356,64oC dan berat sisa 5,01%. Dan dari
morfologi hasil pencampuran Epoksi dan Vinil Ester diperoleh fasa
tunggal atau misible. Berdasarkan hasil penelitian tersebut Polimer
Blend Epoksi/Vinil Ester dapat diajukan sebagai kandidat Printed
Circuit Board (PCB).
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Epoxy is often used as a matrix of Printed Circuit Board (PCB), but
is limited by the toughness and elongation of epoxy which is fairly
low. Therefore, it is necessary to do some research to overcome
these shortcomings. This research is conducted to identify the
effect of addition of vinyl ester on mechanical properties and
thermal resistance of the Polymer Blend Epoxy/Vinyl Ester.
Variations addition of Vinyl Ester in 0, 10, 20, 30, 40, 50, 80, and
100 weight. The research showed a significant enhancement of
tensile strength in addition of 50 Vinyl Ester with a strength value
by 68.30 MPa and the hardness of 80,80 Shore D. The highest
thermal stability is reached by adding 50 of vinyl ester at 356,64oC
and residual weight at 5.01. The morphology of mixing epoxy and
vinyl ester shows a goodmiscibility with a single phase form.
Based on these results, Polymer Blend Epoxy/Vinyl Ester may be
filed as a candidate for Printed Circuit Board (PCB).
| Item Type: | Thesis (Undergraduate) |
|---|---|
| Additional Information: | RSMt 620.118 Sar d |
| Uncontrolled Keywords: | epoksi, miscible, polimer blend, printed circuit board (PCB), vinil ester |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) > TA418.9 Composite materials. Laminated materials. |
| Divisions: | Faculty of Industrial Technology > Material & Metallurgical Engineering > 28201-(S1) Undergraduate Thesis |
| Depositing User: | EKO BUDI RAHARJO |
| Date Deposited: | 30 Oct 2019 06:29 |
| Last Modified: | 30 Oct 2019 06:29 |
| URI: | http://repository.its.ac.id/id/eprint/71499 |
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