Muslih, Giffari (2019) Simulasi Pengaruh Variasi Geometri Termoelektrik Terhadap Unjuk Kerja Medical Coolbox. Other thesis, Institut Teknologi Sepuluh Nopember.
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Abstract
Termoelektrik merupakan sebuah piranti yang dapat mengkonversi energi listrik menjadi energi kalor atau sebaliknya. Pada penelitian ini, dilakukan sebuah simulasi termoelektrik yang terintegrasi dengan simulasi proses pendinginan medical coolbox. Pada simulasi termoelektrik didapatkan pengaruh ketinggian p-n semikonduktor dan jumlah couple p-n semikonduktor yang terdapat dalam module termoelektrik terhadap distribusi temperatur, tegangan dan daya listrik yang dibutuhkan sehingga dapat ditentukan C.O.P dari termoelektrik itu sendiri. Tahapan simulasi proses pendinginan pada medical coolbox terlebih dahulu mensimulasikan proses perpindahan kalor pada heatsink (variasi jumlah fin) dengan menggabungkan termoelektrik dan hasilnya didapatkan temperatur pendinginan yang dijadikan sebagai kondisi batas saat mensimulasikan distribusi temperatur pada medical coolbox dengan variasi kecepatan udara di dalam box tersebut. Sehingga pada penelitian ini didapatkan desain terbaik sistem adalah termoelektrik yang memiliki ketinggian semikonduktor sebesar 0,5 mm, banyaknya couple semikonduktor sebanyak 242 dan jumlah fin heatsink sebanyak 10 fin dengan 16,97oC temperatur sisi dingin termoelektrik, 17,44oC pada dinding box, 17,37oC pada udara bebas di dalam medical coolbox dan 19,2oC pada produk insulin selama 2500 detik.
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Thermoelectric is a device that can convert electrical energy into heat energy or vice versa. In this study, a thermoelectric simulation was conducted which was integrated with the simulation of the medical coolbox cooling process. In the thermoelectric simulation the influence of the height of the semiconductor p-n and the number of p-n semiconductor couples contained in the thermoelectric module on the distribution of temperature, voltage and electrical power are needed so that C.O.P can be determined from the thermoelectric itself. The simulation stage of the cooling process in the medical coolbox by simulating the heat transfer process on the heatsink (variation in number of fin) by combining with thermoelectric and the results obtained cooling temperature which is used as a boundary condition when simulating the temperature distribution in the medical coolbox with variations in air velocity in the box. So that in this study the best system design was obtained that the thermoelectric has a semiconductor height of 0.5 mm, the number of 242 p-n semiconductor couples and 10 fins of heatsink with a thermoelectric cooling temperature of 16.97oC, a cooling air temperature of 17,37oC, the temperature of the box wall is 17,44oC, and the product temperature is 19.2oC from the initial temperature of 25oC.
| Item Type: | Thesis (Other) |
|---|---|
| Additional Information: | RSF 621.042 Mus s-1 2019 |
| Uncontrolled Keywords: | distribusi temperatur, heatsink, medical coolbox, termoelektrik, variasi geometri |
| Subjects: | T Technology > TA Engineering (General). Civil engineering (General) > TA357 Computational fluid dynamics. Fluid Mechanics T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK4035.R4 Refrigeration and refrigerating machinery |
| Divisions: | Faculty of Industrial Technology > Physics Engineering > 30201-(S1) Undergraduate Thesis |
| Depositing User: | Giffari Muslih |
| Date Deposited: | 17 Oct 2024 03:54 |
| Last Modified: | 17 Oct 2024 03:54 |
| URI: | http://repository.its.ac.id/id/eprint/68491 |
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